Jakarta, INTI - Huawei claims it will be able to independently produce semiconductor chips as advanced as its competitors by 2031.
The Chinese technology company stated at a symposium in Shanghai that it will be able to produce chips with transistor densities comparable to the 1.4 nanometer (nm) process expected to be used by competitors, such as Taiwan Semiconductor Manufacturing Corp (TSMC) and Samsung.
According to an Engadget report on Monday, May 25, if successful, this innovation would be a significant milestone for Huawei, which has been the target of US trade sanctions since 2019.
These restrictions have hampered Huawei, leaving it lagging behind competitors in chip innovation by denying it access to the specialized equipment other companies use to achieve the 1.4nm process.
Huawei is Confident Despite Delayed Starting Time
On the other hand, TSMC revealed that its 1.4nm process will begin production in 2028.
Although it will lag behind the leading companies by about five years, Huawei is confident it can offer a more cost-effective solution.
The Wall Street Journal reported that Huawei's chip department head, He Tingbo, said his company could provide a "feasible and affordable" solution.
Currently, China's largest semiconductor manufacturer, Semiconductor Manufacturing International Corp., offers chips with 7nm processors, which can be seen in the Huawei Mate 60 smartphone.
Conclusion
Huawei claims it will be able to independently produce 1.4-nanometer semiconductor chips by 2031 despite still being impacted by US trade sanctions since 2019. The technology is projected to be able to compete with TSMC and Samsung's chip processes, although Huawei is expected to lag behind global competitors by several years. The company assesses that the chip solution it develops will be more affordable.
Read more: Apple Considers Intel and Samsung to Make Its Chips to Reduce Dependency on TSMC