Jakarta, INTI - The Ministry of Industry (Kemenperin) reaffirmed its commitment to accelerating the strengthening of Indonesia's high-tech industries, including the development of the semiconductor sector, as a critical foundation for industrial transformation and technological independence. This commitment aligns with the directives of President Prabowo Subianto to reinforce the national industrial structure and deepen innovation-based downstream processes.
Industry Minister Agus Gumiwang Kartasasmita stated that the efforts to develop a national semiconductor ecosystem are not new but have been consistently pursued by Kemenperin over the past several years.
“Over the past five years, Kemenperin has actively taken initiatives to engage directly in chip design development. These efforts began in 2019 and continued at Hannover Messe in 2023, when Indonesia started building communications and exploring partnerships with global semiconductor industry players,” said the Minister after meeting with the management of the Indonesia Chip Design Collaborative Center (ICDeC) in Jakarta on Tuesday, January 13, 2026.
ICDec is a non profit organization focused on the development of human resources and technology in Integrated Circuits (chip design) in Indonesia. During its formation, the Ministry of Industry of the Republic of Indonesia played a key role as an initiator. This support has been evident since ICDeC’s establishment in 2023, which now includes representatives from 16 universities with chip design experts in Indonesia.
At the Hannover Messe 2023, Kemenperin held initial discussions with several global technology companies. This effort is part of Indonesia’s early strategy to enter the global semiconductor value chain through a realistic and measured approach.
The Minister also emphasized that Kemenperin has signed a Memorandum of Understanding (MoU) with Apple, which includes a commitment to develop research and development (R&D) activities in Indonesia through collaboration with ICDeC. A key focus of this cooperation is the development of national brainware (human resources), which has shown progress through the optimization of the Domestic Component Level (TKDN).
“This collaboration confirms that Indonesia is not just a market, but is also beginning to build capabilities as part of the global innovation ecosystem, particularly in chip design development,” he said.
Integration of Chip Design into National Development Plans
Furthermore, the Minister of Industry expressed his gratitude to Bappenas, noting that the chips design development program has been included in Bappenas’ Blue Book and is being implemented through ICDeC. This strategic project forms part of the broader strategy to development has become a cross-ministerial agenda integrated into national development planning.
To support the implementation of this roadmap, Kemenperin has also prepared physical infrastructure for chip design development, including dedicating a whole floor at the Indonesia Manufacturing Center (IMC) as a space for research, development, and collaboration on national chip design innovation.
“Over the past five years, Kemenperin has also become increasingly active in promoting chip design R%D activities, including providing supporting infrastructure for chip design testing. This is an important part of ensuring that design results meet industry standards and are ready for the next stage in the semiconductor value chain,” he added.
Conclusion
Kemenperin's efforts demonstrate a comprehensive approach to strengthening Indonesia’s semiconductor industry, combining policy support, cross-ministerial collaboration, and dedicated infrastructure. By fostering R&D and ensuring designs meet global standards, the ministry aims to position Indonesia as a capable player in the global semiconductor value chain.
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