Thu, 06 Mar 2025 11:20 | Data Center and Cloud Computing | Editorial INTI
Jakarta, INTI – MediaTek has showcased a range of groundbreaking innovations that will drive the evolution of wireless networks towards the 6G era at the Mobile World Congress (MWC) 2025 in Barcelona, Spain, from Monday, March 3, 2025, to Thursday, March 6, 2025. The technologies presented include Hybrid Computing, live trials of broadband LEO NR-NTN, Sub-Band Full Duplex (SBFD), and the latest M90 5G-Advanced modem.
MediaTek President Joe Chen reaffirmed the company’s commitment to advancing connectivity and AI applications through high-quality products and global standardization. "Our latest developments in 6G-era technology, generative AI hybrid computing, and 5G-Advanced solutions will unlock significant new opportunities in people's daily lives worldwide," he stated.
One of MediaTek’s key innovations is Hybrid Computing, which integrates cloud-based devices with Radio Access Network (RAN) as an "edge cloud." This technology enables ambient computing from devices to RAN, creating ultra-low latency crucial for generative AI development and personal data management. The implementation of Hybrid Computing involves collaboration with NVIDIA, Intel, and G REIGNS.
Additionally, MediaTek introduced Envelope Assisted RFFE, which enhances power amplifier efficiency by up to 25 percent, reduces device heating, and expands bandwidth beyond 100MHz while maintaining the same power level. This technology enables broader coverage with lower power consumption.
Another major highlight is Sub-Band Full Duplex (SBFD), which supports the evolution of 5G-Advanced and 6G. SBFD optimizes the use of unpaired TDD spectrum, extends uplink coverage, and reduces latency, making it a key component in future network advancements.
MediaTek introduced the M90 5G-Advanced Modem, capable of achieving speeds up to 12Gbps while supporting 3GPP Release 17 and 18 specifications. This modem features Smart AI Antenna, which detects usage scenarios and automatically adjusts antennas and uplink power to maintain signal quality.
The integrated MediaTek UltraSave technology reduces power consumption by up to 18 percent compared to previous generations. During live testing at MWC 2025, MediaTek successfully achieved a 10Gbps throughput using an Ericsson network configuration.
In the 5G-Advanced Non-Terrestrial Network (NTN) category, MediaTek showcased next-generation satellite connectivity through Ku-band NR-NTN technology. This technology promises widespread broadband connectivity for 5G devices and has been tested using OneWeb's Low Earth Orbit (LEO) satellites.
MediaTek also unveiled generative AI infrastructure, including Gateway and Context Synchronization systems. These technologies enable smartphones and smart home devices to harness generative AI capabilities more securely without compromising user data privacy.
In the automotive sector, MediaTek introduced Dimensity Auto, a platform that supports multimedia capabilities, 3D graphics, and advanced AI processing through multiple virtual machines (VMs) on a hypervisor. One of its standout features, eCockpit, offers 8K display support, developed in collaboration with strategic partners to enhance future driving experiences.
For the smartphone market, MediaTek unveiled the Dimensity 9400, its latest flagship chipset with generative AI capabilities. Key features include AI Audio Focus, AI Telephoto, and enhanced ray-traced graphics for a more immersive gaming experience.
With its wide array of innovations unveiled at MWC 2025, MediaTek continues to assert its dominance in the wireless technology industry. These advancements not only reinforce the company’s role in shaping global standards for the 6G era but also solidify its position as a leader in future communications technology.
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